CHOICE is the latest paste technology that is specially developed to meet continuously increasing customer requirements. The solder paste’s optimized rosin based chemistry offers the best printing and wetting properties in Pb-free as well as SnPb. Because of the uniform paste flux technology for SnPb and Pb-free, it is easy to switch from SnPb to Pb-free. The solder paste is designed to achieve printing speeds up to 250 mm/s for the most demanding throughputs. The combination of solvents and activators used in this paste returns a large process window for the reflow process. High yields can be achieved with fast conveyor speeds and short cycle times.
CHOICE solder paste halogen and halide-free, is available with low-cost alloys such as SN100C and SCANGe-071. These solder pastes have no or low silver contents and are ideal for cost driven markets, but CHOICE is also available in SAC305. Due to its outstanding activation system, the paste eliminates Head-in-Pillow defects that are critical in lead-free soldering of BGAs. Even with the smallest components, such as 01005 or 0201, this paste does not show graping or other defects. It provides perfect wetting conditions for the most reliable solder joints.
CHOICE solder paste halogen and halide-free, is available with low-cost alloys.